Method of making a molded lead frame

Details Method of making a molded lead frame Method of making a molded lead frame

1995-05-10

1996-05-21

Jordan, Charles T.

Powder metallurgy processes

Forming articles by uniting randomly associated metal particles

Consolidation of powders

419 61, B22F 500, B22F 302

Patent

active

055186840

ABSTRACT:
A lead frame for use in an integrated circuit package is herein disclosed wherein the lead frame is produced by molding an electrically conductive material into a desired lead frame shape. There is also disclosed several possible arrangements for a lead frame produced using the molding method including, protrusions on the lead frame adapted to provide a mechanical connection to the integrated circuit package, a heat sink molded as an integral part of the lead frame with heat dissipating characteristics specific to the application in which the lead frame will be used, and an arrangement which provides a heat conducting portion adapted to thermally connect a component attached to the lead frame to an external heat sink.

REFERENCES:
patent: 5250130 (1993-10-01), Enloe et al.
patent: 5310520 (1994-05-01), Jha et al.

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