4. Powder metallurgy processes
  5. Forming articles by uniting randomly associated metal particles
  6. Consolidation of powders

David A. Pruitt

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Lead plating technique for singulated IC packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Leadframe with support members

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Method of making a molded lead frame

Powder metallurgy processes – Forming articles by uniting randomly associated metal particles – Consolidation of powders
Patent

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Profile ID: LFUS-PAI-P-1807582

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