Method of making a millimeter wave monolithic integrated circuit

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156653, 1566591, 156657, 156662, 357 40, 357 65, 357 81, 437203, 437228, 437241, 437902, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

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048614262

ABSTRACT:
A method is provided of making a millimeter wave monolithic integrated ciit that allows for device isolation during epitaxial growth and integral heat sink with supporting circuitry on the substrate.

REFERENCES:
patent: 4675525 (1987-06-01), Amingual et al.

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