Method of making a micro-dimensional coupling conductor

Details Method of making a micro-dimensional coupling conductor Method of making a micro-dimensional coupling conductor

1995-05-24

1997-09-02

Niebling, John

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

427 96, 4272553, 427259, 257522, 257728, 257735, 216 14, H01L 2144

Patent

active

056630956

ABSTRACT:
A micro-dimensional coupling conductor with a shape that is customized for a particular electronic device. A fabrication method is used in which the physical dimensions of the conductor are precisely controlled with photolithographic techniques, resulting in a conductor that is more precisely tuned to the operating frequency of the device. The conductor is fabricated on an SiO.sub.2 substrate using vacuum deposition or electroplating techniques. After fabrication, the conductor is separated from the SiO.sub.2 substrate by dissolving the SiO.sub.2. Alternatively, the conductor may be fabricated on a Teflon.TM. substrate. The use of a Teflon substrate allows a user to remove the conductor from the substrate by applying a small mechanical force to the conductor.

REFERENCES:
patent: 4052787 (1977-10-01), Shaheen et al.
patent: 4448800 (1984-05-01), Ehara et al.
patent: 4733290 (1988-03-01), Reardn et al.
patent: 4839712 (1989-06-01), Mamodaly et al.
patent: 5530282 (1996-06-01), Tsuji
D. V. Morgan and K. Board, An Introduction to Semiconductor Microtechnology (Second Editional), John Wiley & Sons, Chichester (1990), pp. 111-114.

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