Method of making a metallic pattern on a substrate

Details Method of making a metallic pattern on a substrate Method of making a metallic pattern on a substrate

1990-06-04

1991-12-17

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

1566591, 156666, 156668, 156904, 430323, 430325, 430330, 29846, 205125, 205224, C25D 548, C23F 102

Patent

active

050732331

ABSTRACT:
Metallic patterns, such as printed circuits, are prepared by immersing metal substrates, bearing electrodeposited films and resist films in patterned areas, into an aqueous solution or dispersion of a hardening agent so that the hardening agent diffuses only into the electrodeposited film. This is followed by curing the hardening agent by heat or irradiation to render it resistant to the solvent used to remove the resist film and to the etchant solution for the metal exposed when the resist film is removed.

REFERENCES:
patent: 3542739 (1970-11-01), Krimm et al.
patent: 4113958 (1978-09-01), Tucker
patent: 4125661 (1978-11-01), Messerschmidt, Jr. et al.
patent: 4375498 (1983-03-01), Le Minez et al.
patent: 4604344 (1986-08-01), Irving et al.
patent: 4746399 (1988-05-01), Demmer et al.
patent: 4751172 (1988-06-01), Rodriguez et al.
patent: 4861438 (1989-08-01), Banks et al.
Derwent Abst. No. 02694T-AL, Oct. 5, 1971.

Affiliated with

Also associated with

Rating

Method of making a metallic pattern on a substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a metallic pattern on a substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a metallic pattern on a substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-833758