Method of making a MEMS electrostatic chuck

Details Method of making a MEMS electrostatic chuck Method of making a MEMS electrostatic chuck

2005-09-20

2005-09-20

Dang, Trung (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S761000, C438S778000, C438S800000

Reexamination Certificate

active

06946403

ABSTRACT:
The present invention is directed to a method of forming a clamping plate for a multi-polar electrostatic chuck. The method comprises forming a first electrically conductive layer over a semiconductor platform and defining a plurality of portions of the first electrically conductive layer which are electrically isolated from one another. A first electrically insulative layer is formed over the first electrically conductive layer, the first electrically insulative layer comprising a top surface having a plurality of MEMS protrusions extending a first distance therefrom. A plurality of poles are furthermore electrically connected to the respective plurality of portions of the first electrically conductive layer, wherein a voltage applied between the plurality of poles is operable to induce an electrostatic force in the clamping plate.

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