Fishing – trapping – and vermin destroying
Patent
1987-12-03
1989-04-04
Hearn, Brian E.
Fishing, trapping, and vermin destroying
29739, 437974, 228179, 228209, 357 80, H01L 2160, H01L 2158
Patent
active
048187283
ABSTRACT:
A method for making a semiconductor device of a type comprising at least first and second semiconductor circuit units, which method comprises the step of forming a plurality of connecting electrodes on an upper surface of each of at least first and second semiconductor substrates; forming an electrically insulating layer entirely over the upper surface of each of the first and second substrates so as to cover the respective connecting electrodes; partially removing the insulating layer on each of the first and second substrates to permit the respective electrodes to be exposed to the outside; forming metal studs on the first substrate in contact with the electrodes so as to protrude outwardly of the respective insulating layer to complete the first semiconductor unit and forming solder deposits on the second substrate in contact with the respective electrodes on such second substrate to complete the second semiconductor unit; combining the first and second semiconductor units with the metal studs in the first semiconductor unit aligned respectively with the solder deposits in the second semiconductor unit; and heating the resultant assembly to allow the solder deposits to be melted with the associated metal studs consequently immersed into the melted solder deposits thereby to accomplish a firm interlock between the electrodes on the first and second substrates.
REFERENCES:
patent: 3436818 (1965-12-01), Merrin et al.
patent: 4701424 (1987-10-01), Mikkor
Nukii Takashi
Rai Akiteru
Yamamura Keiji
Hearn Brian E.
Pawlikowski Beverly A.
Sharp Kabushiki Kaisha
LandOfFree
Method of making a hybrid semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a hybrid semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a hybrid semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-180491