Method of making a high melting point solder ball coated with a

Metal fusion bonding – Process – Preplacing solid filler

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

22818022, 427 96, B23K 3512, B23K 3102, B05D 512

Patent

active

060504811

ABSTRACT:
A method of forming a solder ball structure comprising the steps of 1) obtaining a first object having at least one high melting point solder ball, each solder ball having a corresponding BLM containing a low melting point solder, each solder ball having an outer surface, top and bottom, each BLM having a top and bottom, the bottom of each solder ball in contact with the top of the corresponding BLM over a portion of the outer surface, the bottom of each BLM in electrical communication with the first object; 2) obtaining a template having a first surface; 3) applying a disjoint area of low melting point solder paste to the first surface of the template; 4) interacting the top of each solder ball and the solder paste; and 5) reflowing each solder ball and disjoint area of solder paste while each solder ball and disjoint area of solder paste are interacted.

REFERENCES:
patent: 4795554 (1989-01-01), Bernardi
patent: 5118027 (1992-06-01), Braun et al.
patent: 5147084 (1992-09-01), Behun et al.
patent: 5154341 (1992-10-01), Melton et al.
patent: 5282565 (1994-02-01), Melton
patent: 5409157 (1995-04-01), Nagesh et al.
patent: 5480835 (1996-01-01), Carney et al.
patent: 5529957 (1996-06-01), Chan
patent: 5542174 (1996-08-01), Chiu
patent: 5586715 (1996-12-01), Schwiebert et al.
patent: 5634268 (1997-06-01), Dalal et al.
patent: 5718361 (1998-02-01), Dalal et al.
patent: 5729896 (1998-03-01), Dalal et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a high melting point solder ball coated with a does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a high melting point solder ball coated with a , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a high melting point solder ball coated with a will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2330049

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.