Method of making a flexible circuit member

Details Method of making a flexible circuit member Method of making a flexible circuit member

1991-05-06

1992-09-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 156656, 1566591, 156666, 156901, 252 792, B44C 122, B29C 3700, C23F 100

Patent

active

051455536

ABSTRACT:
A method of making a flexible circuit member including a stainless steel base member, a dielectric layer (polyimide) on the base member and a conductive circuit (copper) on the dielectric. The circuit member may be first formed as a laminate structure wherein the dielectric polyimide is coated on the stainless steel and appropriately treated (cured). The copper circuitry is then formed utilizing resist application and exposure techniques. Significantly, the copper-containing circuitry and stainless steel base member are simultaneously etched using a cupric chloride etchant solution to effectively remove desired portions of these metallic materials and produce the desired flexible circuit member.

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