Method of making a circuitized substrate

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C029S825000, C029S829000, C029S837000, C029S846000, C029S852000, C216S013000, C216S048000, C257S623000, C257S773000, C257SE21309

Reexamination Certificate

active

07596862

ABSTRACT:
A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an opening in the conductive layer. The conductive layer includes an end portion spaced from the opening, the end portion forming an acute angle with the substantially planar upper surface of the substrate. The at least one side wall is substantially perpendicular to the substantially planar upper surface of the substrate.

REFERENCES:
patent: 3867217 (1975-02-01), Maggs et al.
patent: 4780177 (1988-10-01), Wojnarowski et al.
patent: 4783421 (1988-11-01), Carlson et al.
patent: 4877481 (1989-10-01), Fukuda et al.
patent: 5028513 (1991-07-01), Murakami et al.
patent: 5104480 (1992-04-01), Wojnarowski et al.
patent: 5445710 (1995-08-01), Hori et al.
patent: 5666722 (1997-09-01), Tamm et al.
patent: 5744758 (1998-04-01), Takenouchi et al.
patent: 5753418 (1998-05-01), Tsai et al.
patent: 6004619 (1999-12-01), Dippon et al.
patent: 6035527 (2000-03-01), Tamm
patent: 6107119 (2000-08-01), Farnworth et al.
patent: 6376049 (2002-04-01), Asai et al.
patent: 0480703 (1992-04-01), None
patent: PEPA61-42438 (1986-09-01), None
patent: PUPA03-268478 (1991-11-01), None
patent: 5291730 (1993-11-01), None
patent: 9116255 (1997-05-01), None
patent: 9246688 (1997-09-01), None
patent: PUPA2002-261425 (2002-09-01), None
IBM TDB, vol. 29, No. 9, Feb. 1987, “PC Board Construction Method.”

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of making a circuitized substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of making a circuitized substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a circuitized substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4121003

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.