Method of making a circuitized substrate

Details Method of making a circuitized substrate Method of making a circuitized substrate

2007-09-28

2009-10-06

Phan, Thiem (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S829000, C029S837000, C029S846000, C029S852000, C216S013000, C216S048000, C257S623000, C257S773000, C257SE21309

Reexamination Certificate

active

07596862

ABSTRACT:
A method of making the circuitized substrate. The circuitized substrate includes a substrate having a substantially planar upper surface and a conductive layer positioned on the substantially planar upper surface. The conductive layer includes at least one side wall therein, defining an opening in the conductive layer. The conductive layer includes an end portion spaced from the opening, the end portion forming an acute angle with the substantially planar upper surface of the substrate. The at least one side wall is substantially perpendicular to the substantially planar upper surface of the substrate.

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