Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1998-03-17
2000-08-29
Baxter, Janet
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430314, 430315, 430316, 430318, G03F 700
Patent
active
06110650&
ABSTRACT:
A method of making a circuitized substrate wherein a chip-accommodating cavity is formed along with a plurality of conductive elements (e.g., pads, lines, etc.) which form part of the substrate's circuitry. Metallization is facilitated by the use of a photoimageable member that allows for initial removal (peeling) of its sacrificial layer, followed by eventual removal of the photoimaging layer which also forms part of this member. Exposure of the photoimaging layer may occur either through the protective sacrificial layer or subsequent removal thereof.
REFERENCES:
patent: 4211563 (1980-07-01), Goldman
patent: 4237210 (1980-12-01), Dougherty
patent: 4259421 (1981-03-01), Goldman
patent: 4773955 (1988-09-01), Mabuchi et al.
patent: 4985601 (1991-01-01), Hagner
patent: 5022960 (1991-06-01), Takeyama et al.
patent: 5048179 (1991-09-01), Shindo et al.
patent: 5098526 (1992-03-01), Bernhardt
patent: 5102829 (1992-04-01), Cohn
patent: 5137618 (1992-08-01), Burnett et al.
patent: 5142448 (1992-08-01), Kober et al.
patent: 5144534 (1992-09-01), Kober
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5209817 (1993-05-01), Ahmad et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5288542 (1994-02-01), Cibulsky
patent: 5397917 (1995-03-01), Ommen et al.
patent: 5422513 (1995-06-01), Marcinkiewicz et al.
patent: 5542175 (1996-08-01), Bhatt et al.
patent: 5566448 (1996-10-01), Bhatt et al.
patent: 5599747 (1997-02-01), Bhatt et al.
Bhatt Anilkumar Chinuprasad
Miller Thomas Richard
Moring Allen Frederick
Walsh James Paul
Baxter Janet
Fraley Lawrence R.
International Business Machines - Corporation
Walke Amanda C.
LandOfFree
Method of making a circuitized substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of making a circuitized substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of making a circuitized substrate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1248158