Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1996-06-14
1997-10-21
Nguyen, Nam
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
134 1, 134 11, B08B 700
Patent
active
056792140
ABSTRACT:
A method of maintaining a strong endpoint detection signal, for RIE processes, has bean developed. After numerous RIE procedures have been performed, in a specific RIE chamber, an insitu dry cleaning procedure is implemented to remove polymer from a window in the RIE tool, a window that is used for monitoring endpoint. The insitu dry cleaning procedure is performed using oxygen or chlorine, in the etching chamber of a single wafer RIE tool, while wafers, waiting to be etched, reside in a different chamber of the single wafer RIE tool. The ability to insitu dry clean, results in little interruption in the utilization of the etching function of this tool.
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Alejandro Luz
Nguyen Nam
Saile George O.
Taiwan Semiconductor Manufacturing Company Ltd
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