Method of machining substrate and method of manufacturing...

Details Method of machining substrate and method of manufacturing... Method of machining substrate and method of manufacturing...

2005-12-14

2008-12-23

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C257SE21599

Reexamination Certificate

active

07468310

ABSTRACT:
A method of machining a substrate etches a substrate according to a predetermined length and depth from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines being used to cut the substrate, and divides the substrate along the predetermined dividing lines which are not etched by laser machining.

REFERENCES:
patent: 6121118 (2000-09-01), Jin et al.
patent: 2002-192367 (2002-07-01), None
patent: 2002-205180 (2005-07-01), None

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