Method of lithographic image alignment for use with a dual...

Radiation imagery chemistry: process – composition – or product th – Registration or layout process other than color proofing

Reexamination Certificate

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C430S030000, C430S312000

Reexamination Certificate

active

07108946

ABSTRACT:
Methods of fabricating an integrated circuit on a wafer using dual mask exposure lithography is disclosed. Improved mask image alignment between a first mask image and a second mask image of a dual mask exposure technique can be achieved by aligning the second mask image to a latent image created by an exposure using the first mask image.

REFERENCES:
patent: 5563012 (1996-10-01), Neisser
patent: 6139995 (2000-10-01), Burm et al.
patent: 6269322 (2001-07-01), Templeton et al.
patent: 6420224 (2002-07-01), Kajita et al.
patent: 6552790 (2003-04-01), Templeton et al.
patent: 2003/0064307 (2003-04-01), Nakamura et al.

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