Method of laser patterning an electrical interconnect

Details Method of laser patterning an electrical interconnect Method of laser patterning an electrical interconnect

1989-06-16

1991-01-08

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156643, 156652, 156644, 156656, 156657, 1566591, 1566611, 156662, 156668, 21912185, 357 71, 437192, 437194, 437198, 437199, 437246, H01L 71306, B44C 122, C03C 1500, C23F 102

Patent

active

049832506

ABSTRACT:
Forming an electrical interconnect by applying an adhesion layer over a substrate, applying an electrical conductor layer over the adhesion layer, and applying a reacting layer over the electrical conductor layer. A laser beam is directed over the reacting layer in a desired pattern to interdiffuse the reacting and conductor layers and form a reaction product. The reaction product is used as an etch mask for etching away the reacting layer, the conductor layer, and the adhesion layer outside of the reaction product.

REFERENCES:
patent: 4450041 (1984-05-01), Aklufi
patent: 4566937 (1986-01-01), Pitts
patent: 4569124 (1986-02-01), Rench et al.

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