Method of joining an insulator element to a substrate

Details Method of joining an insulator element to a substrate Method of joining an insulator element to a substrate

2005-09-06

2005-09-06

Le, Dung A. (Department: 2818)

Semiconductor device manufacturing: process

Formation of electrically isolated lateral semiconductive...

Total dielectric isolation

C438S455000, C438S457000

Reexamination Certificate

active

06939778

ABSTRACT:
Bonding methods and articles produced thereby are provided wherein an insulator, such as glass, is bonded to a solder with the assistance of an electric field.

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