Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1990-04-27
1992-05-05
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156643, 156657, 1566591, 156662, H01L 2100
Patent
active
051104113
ABSTRACT:
Disclosed is a method of isotropically dry etching a WSi.sub.x /polysilicon sandwich structure on a silicon substrate wafer containing integrated semiconductor circuits. The method is conducted within a parallel plate reactor which in operation provides a substantially constant power density over the parallel plates. The reactor parallel plates are spaced a preselected separation distance from one another and a preselected amount of electrical power is applied thereto. Gases are injected to within the reactor provide a reactive gas mixture at a preselected pressure. The reactive gas mixture comprises SF.sub.6, Cl.sub.2, and O.sub.2 in approximate respective volume ratios of 7.0.+-.5%:5.0.+-.5%:4.0.+-.5%. The wafer is subjected to the reactive gas mixture at the preselected pressure for a preselected amount of time to selectively obtain a desired isotropic etch of the WSi.sub.x /polysilicon.
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Goudreau George
Micro)n Technology, Inc.
Simmons David A.
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