Method of integrated circuit fabrication

Details Method of integrated circuit fabrication Method of integrated circuit fabrication

1996-12-18

2000-02-01

Niebling, John F.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438631, 438645, 438948, 438949, H01L 214763

Patent

active

060202564

ABSTRACT:
Dielectric planarization is achieved by Defocus and under exposure of photoresist. The photoresist may be etched at the same rate as the dielectric, thereby yielding a smooth or planarized dielectric.

REFERENCES:
patent: 5213992 (1993-05-01), Lu
patent: 5609994 (1997-03-01), Lee

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