Method of inspecting a semiconductor device and an apparatus...

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C356S237500, C382S149000, C382S224000

Reexamination Certificate

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07061602

ABSTRACT:
A method of inspecting a sample in which the sample is inspected under a plurality of inspection conditions and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

REFERENCES:
patent: 5986263 (1999-11-01), Hiroi et al.
patent: 6002989 (1999-12-01), Shiba et al.
patent: 6583414 (2003-06-01), Nozoe et al.
patent: 6888959 (2005-05-01), Hamamatsu et al.

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