Method of inkless wafer blind assembly

Details Method of inkless wafer blind assembly Method of inkless wafer blind assembly

2005-08-09

2005-08-09

Zarneke, David A. (Department: 2829)

Semiconductor device manufacturing: process

With measuring or testing

Reexamination Certificate

active

06927081

ABSTRACT:
A method of blind assembly processing a wafer by pick and place equipment is described. This method includes determining the wafer diameter or radius and determining the bad die edge exclusive zone. This determined diameter or radius and the determined edge exclusive zone is used to make a black paper mask and place it over the wafer or to cut or saw away from the wafer the bad die edge exclusive zone. This enables the pick and place equipment to avoid the bad dies in the bad die edge exclusive zone.

REFERENCES:
patent: 5773315 (1998-06-01), Jarvis
patent: 5811314 (1998-09-01), Chen et al.
patent: 6682948 (2004-01-01), Wada
patent: 6756796 (2004-06-01), Subramanian
patent: 6763578 (2004-07-01), Farnworth et al.
patent: 6767803 (2004-07-01), Tsujimoto

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