Method of improving interconnect of semiconductor devices by uti

Details Method of improving interconnect of semiconductor devices by uti Method of improving interconnect of semiconductor devices by uti

1999-01-19

2000-03-07

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257780, 257758, 257784, H01L 2160, H01L 2328

Patent

active

060344407

ABSTRACT:
An improved wire bond with the bond pads of semiconductor devices and the lead fingers of lead frames. More specifically, an improved wire bond with ball bonds previously made on the bond pads of semiconductor devices and/or lead fingers of lead frames.

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