Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1996-05-17
1998-02-03
Nguyen, Nam
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
216 67, 216 79, 216 64, 1566461, 437228, C23F 100
Patent
active
057140375
ABSTRACT:
Methods for improving adhesion between various materials utilized in the fabrication of integrated circuits. A first method relates to improving adhesion between a silicon nitride layer and a silicon dioxide layer. The method includes treating a surface of the silicon dioxide layer with a nitrogen plasma in a reactive ion etching process prior to depositing the silicon nitride film on the surface of the silicon dioxide layer. A second method relates to improving adhesion between a silicon nitride layer and a polyimide layer. The method includes the step of treating a surface of the silicon nitride layer with a oxygen/argon plasma in a reactive ion etching process prior to depositing the polyimide layer film on the surface of the silicon nitride layer. A third method relates to improving adhesion between a photoresist layer and a metal. The method includes the step of treating a surface of the photoresist layer with a oxygen/argon plasma in a reactive ion etching process prior to depositing the metal on the surface of the photoresist layer.
REFERENCES:
patent: 4987102 (1991-01-01), Nguyen et al.
Blount Tom
Liang Ray
Puntambekar Kumar D.
Ramanujam K. Y.
Alejandro Luz
MicroUnity Systems Engineering, Inc.
Nguyen Nam
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