Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-08-16
1997-12-23
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29830, 174260, 22818021, H05K 334
Patent
active
056996110
ABSTRACT:
A package containing an integrated circuit has all of its I/O contacts on one of the package faces. The periphery of that face is processed to be wettable with solder. The substrate to which the package is to be attached has corresponding contacts and has a solder wettable ring comparable to the ring at the periphery at the package face. When the package is positioned on the substrate it is hermetically sealed therearound by soldering the two rings together, such as by reflow soldering.
REFERENCES:
patent: 4439918 (1984-04-01), Carroll, II et al.
patent: 4505035 (1985-03-01), Burton et al.
patent: 5219377 (1993-06-01), Poradish
patent: 5341564 (1994-08-01), Akhavain et al.
patent: 5446960 (1995-09-01), Issacs et al.
patent: 5456003 (1995-10-01), Yamamoto et al.
Kurogi Garrett Isao
Swass Matthew J.
Alkov Leonard A.
Arbes Carl J.
Denson-Low Wanda K.
Hughes Electronics
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