Process for connecting electronic devices

Details Process for connecting electronic devices Process for connecting electronic devices

1995-06-07

1997-12-23

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29852, 22818021, H05K 1334

Patent

active

056996101

ABSTRACT:
In a first step, a first substrate is prepared. The first substrate has a first surface, a second surface, and a through-hole therebetween. In a second step, a second substrate is prepared. The second substrate has a first surface, a second surface, and a pad on the first surface of the second substrate. In a third step, a solder is provided on the pad of the second substrate. In a fourth step, the through-hole of the first substrate is positioned on the solder. The second surface of the first substrate and the first surface of the second substrate face each other. In a fifth step, the solder is heated to flow the solder into the through-hole of the first substrate. In the sixth step, an appearance of the solder on the first surface of the first substrate may be confirmed for detection of a connection of the solder.

REFERENCES:
patent: 5129142 (1992-07-01), Bindra et al.
patent: 5218761 (1993-06-01), Maniwa et al.
patent: 5261155 (1993-11-01), Angulas et al.
patent: 5317801 (1994-06-01), Tanaka et al.
R. Tummala et al.; "Microelectronics Packaging Handbook"; Van Nostrand Reinhold, 1989; pp. 209-219 and 422.

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