Method of heating and cooling a wafer during semiconductor proce

Details Method of heating and cooling a wafer during semiconductor proce Method of heating and cooling a wafer during semiconductor proce

1994-08-12

1996-01-16

Flanigan, Allen J.

Heat exchange

Regenerator

Checker brick structure

29 2501, H01L 2102

Patent

active

054840112

ABSTRACT:
A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the wafer and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring in only a few narrow regions that act as conductive bridges when the depositing layer is conductive.

REFERENCES:
patent: 4261762 (1981-04-01), King
patent: 4457359 (1984-07-01), Holden
patent: 4512391 (1985-04-01), Harra
patent: 4527620 (1985-07-01), Pedersen et al.
patent: 4542293 (1985-09-01), Holden
patent: 4671204 (1987-06-01), Ballou
patent: 4743570 (1988-05-01), Lamont, Jr.
patent: 4842683 (1989-06-01), Cheng et al.
patent: 4949783 (1990-08-01), Lakios etal.
patent: 4978412 (1990-12-01), Aoki et al.
patent: 4990047 (1991-02-01), Wagner et al.
patent: 5037262 (1991-08-01), Moll et al.
patent: 5090900 (1992-02-01), Rudolph et al.

Affiliated with

Also associated with

Rating

Method of heating and cooling a wafer during semiconductor proce does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of heating and cooling a wafer during semiconductor proce, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of heating and cooling a wafer during semiconductor proce will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-303428