Method of heat treating a semiconductor wafer to reduce stress

Details Method of heat treating a semiconductor wafer to reduce stress Method of heat treating a semiconductor wafer to reduce stress

1997-03-26

1999-04-13

Bowers, Charles

Semiconductor device manufacturing: process

Radiation or energy treatment modifying properties of...

438795, 438796, 438799, 438778, 438758, 438931, H01L 4108

Patent

active

058937609

ABSTRACT:
A susceptor in a semiconductor wafer heat treatment apparatus holds a wafer such that the wafer is made flat at a heat treatment temperature. In particular, the susceptor is constituted by an elastic platy member which is convex upward with respect to the direction of the gravity. Therefore, when the wafer is subjected to a high-temperature heat treatment, a crystal defect in the wafer can be suppressed.

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