Method of growing silicon monocrystal

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate

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117 13, 423348, C30B 1530

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active

060487798

ABSTRACT:
There is provided a method of growing silicon monocrystal by Czochralski method where cusp field is applied to molten silicon, including the step of applying cusp field to molten silicon so that a center of the cusp field is situated at a depth of one-third or greater of an entire depth of the molten silicon, the depth being defined as a distance from a surface level of the molten silicon. The method makes it possible to eliminate growth slits in all regions in a growth direction of grown silicon monocrystal, and in addition, to accomplish uniform oxygen concentration profile where a difference in an oxygen concentration in a direction of a diameter of crystal is equal to or smaller than 5%. Furthermore, the method makes it possible to eliminate growth slits in all regions in a growth direction in a large-diameter silicon monocrystal, for instance, having a 40 cm-diameter.

REFERENCES:
patent: 4350557 (1982-09-01), Scholl et al.
patent: 5840116 (1998-11-01), Kubo
patent: 5925185 (1999-06-01), Kawashima et al.
H. Hirata et al., "Silicon Crystal Growth in a Cusp Magnetic Field", Journal of Crystal Growth, vol. 96, (1989), pp. 747-755.
H. Hirata et al., Homogeneous Increase in Oxygen Concentration in Czochralski Silicon Crystals by a Cusp Magnetic Field, vol. 98, (1989), pp. 777-781.

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