Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-01-15
2009-10-27
Nhu, David (Department: 2895)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S235000, C257SE21053, C257SE21126, C257SE21127, C257SE21352, C257SE21372
Reexamination Certificate
active
07608532
ABSTRACT:
A method of growing nitride semiconductor material and particularly a method of growing Indium nitride is disclosed can increase surface flatness of a nitride semiconductor material and decrease density of V-defects therein. Further, the method can increase light emission efficiency of a quantum well or quantum dots of the produced LED as well as greatly increase yield. The method is also applicable to the fabrications of electronic devices made of nitride semiconductor material and diodes of high breakdown voltage for rectification. The method can greatly increase surface flatness of semiconductor material for HBT, thereby increasing quality of the produced semiconductor devices.
REFERENCES:
patent: 6440214 (2002-08-01), Hooper et al.
patent: 6806115 (2004-10-01), Koide et al.
patent: 7182811 (2007-02-01), Ishida
patent: 7235818 (2007-06-01), Kim et al.
patent: 7358112 (2008-04-01), Barnes et al.
Chyi Jen-Inn
Lin Hung-Cheng
National Central University
Nhu David
Shih Chun-Ming
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