Method of forming via holes in a insulation film and method of c

Details Method of forming via holes in a insulation film and method of c Method of forming via holes in a insulation film and method of c

1994-12-27

1997-05-13

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

134 13, 438759, 438940, B23K 2600

Patent

active

056289260

ABSTRACT:
A method of forming via holes in an organic insulation film or cutting the film includes the steps of exposing predetermined parts of the film to a laser beam to raise a temperature of the exposed parts of the film until the exposed parts are transformed or decomposed and subjecting the film to an ultra sonic wave so that the transformed or decomposed parts are dispersed.

REFERENCES:
patent: 4764485 (1988-08-01), Loughran et al.
patent: 4961259 (1990-10-01), Schreiber
patent: 5169678 (1992-12-01), Cole et al.
patent: 5233157 (1993-08-01), Schreiber et al.
patent: 5302547 (1994-04-01), Wojnarowski et al.
patent: 5316803 (1994-05-01), White, Jr. et al.
patent: 5386430 (1995-01-01), Yamagishi et al.
Srinivasan, R. et al., "Self-developing photoetching of poly (ethylene terephthalate) films by far-ultraviolet excimer laser radiation", Applied Physics Letter, vol. 41, No. 6, 15 Sep. 1982, pp. 576-578

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