Method of forming thin film transistor array substrate

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Details

C438S151000, C438S155000, C438S158000, C438S159000, C438S701000, C257SE21370, C257SE21372, C257SE21414

Reexamination Certificate

active

07943441

ABSTRACT:
A method of forming a thin-film transistor array substrate is provided. A first mask is used to define a source, a drain and a channel on a substrate. A dielectric layer is formed to cover the source, the drain, the channel and the substrate. A second mask is used to define a patterned photoresist and the dielectric layer. A transparent conductive layer is formed to cover the patterned photoresist and the substrate. A lift-off process is performed to remove the patterned photoresist and a portion of the transparent conductive layer disposed on the patterned photoresist. A third mask is used to define a gate disposed on the dielectric layer.

REFERENCES:
patent: 5264383 (1993-11-01), Young
patent: 6537840 (2003-03-01), Tseng
patent: 7005331 (2006-02-01), Chen
patent: 7016007 (2006-03-01), Chang
patent: 7078279 (2006-07-01), Yoo
patent: 7550327 (2009-06-01), Lee et al.
patent: 2007/0155068 (2007-07-01), Lee et al.
patent: 2009/0085032 (2009-04-01), Chiu et al.
patent: 2009/0176325 (2009-07-01), Jeon et al.

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