Method of forming thin film transistor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Reexamination Certificate

active

07807519

ABSTRACT:
A thin film transistor including a gate, a gate insulating layer, a semiconductor layer and a source/drain is provided. The gate is disposed over a substrate and includes at least one molybdenum-niobium alloy nitride layer. The gate insulating layer is formed over the substrate to cover the gate. The semiconductor layer is disposed over the gate insulating layer above the gate. The source/drain is disposed over the semiconductor layer.

REFERENCES:
patent: 2002/0047947 (2002-04-01), Hur et al.
patent: 2002/0119586 (2002-08-01), Kido
patent: 2005/0024519 (2005-02-01), Nishida et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming thin film transistor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming thin film transistor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming thin film transistor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4220095

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.