Method of forming thin film resistor

Details Method of forming thin film resistor Method of forming thin film resistor

1972-12-07

1977-05-03

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29620, 156659, 156662, 156663, 204192R, 204298, 338308, 427 38, 427102, 427103, 427251, 427294, C23F 102

Patent

active

040212777

ABSTRACT:
A process is disclosed for vacuum depositing by co-sputtering a thin film nickel-chromium resistor of metastable composition. Also disclosed is a resistor made by this process, which resistor possesses a near zero temperature coefficient of resistance.

REFERENCES:
patent: 3325258 (1967-06-01), Fottler et al.
patent: 3400066 (1968-09-01), Caswell et al.
patent: 3402073 (1968-09-01), Pierce et al.
patent: 3528906 (1970-09-01), Cash, Jr. et al.
patent: 3669730 (1972-06-01), Lepselter
patent: 3756847 (1973-09-01), Leibowitz et al.

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