Plastic and nonmetallic article shaping or treating: processes – Laser ablative shaping or piercing
Patent
1998-06-22
2000-09-05
Derrington, James
Plastic and nonmetallic article shaping or treating: processes
Laser ablative shaping or piercing
264402, 264610, 264642, 264225, 264226, 264227, 264317, C04B 3700
Patent
active
061138363
ABSTRACT:
A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.
REFERENCES:
patent: 3870776 (1975-03-01), McMahon
patent: 4119480 (1978-10-01), Nishi et al.
patent: 4336320 (1982-06-01), Cummings et al.
patent: 4555285 (1985-11-01), Chance
patent: 4576850 (1986-03-01), Martens
patent: 4619804 (1986-10-01), Leonard et al.
patent: 4816200 (1989-03-01), Stecher
patent: 4994215 (1991-02-01), Wiech
patent: 5124089 (1992-06-01), Ohkoshi et al.
patent: 5183597 (1993-02-01), Lu
patent: 5328816 (1994-07-01), Tamura
patent: 5814262 (1998-09-01), Ketcham et al.
patent: 5814267 (1998-09-01), Sakai et al.
World Patents Index, week 2278, AN=78-39632A, Derwent Publications Ltd, London, GB; & JP-A-53 045 290 (Koatsu Gas Kogyo K.K.) Apr. 22, 1978* Abstract*.
Microelectronics and Reliability, vol. 25, No. 1, 1985, pp. 61-63, Oxford, GB; A. Singh et al.: "Reverse photolithographic technique for thick film circuits"* Whole document* .
Patent Abstracts of Japan, vol. 008, No. 059 (E-232) Mar 17 1984 & JP-A-58 209 852 (Futaba Denshi Kogyo KK) Dec. 6 1983.
Fujii Hideaki
Matsumoto Takeshi
Mineo Norikazu
Ono Norikatsu
Sakai Yorihiko
Dai Nippon Insatsu Kabushiki Kaisha
Derrington James
LandOfFree
Method of forming thick film pattern and material for forming th does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming thick film pattern and material for forming th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming thick film pattern and material for forming th will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2208921