Plastic and nonmetallic article shaping or treating: processes – Laser ablative shaping or piercing
Patent
1991-09-19
1996-12-03
Derrington, James
Plastic and nonmetallic article shaping or treating: processes
Laser ablative shaping or piercing
264 62, 264402, 264482, 264488, 264317, C04B 3700
Patent
active
055805116
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method of forming a thick film pattern in a manufacturing process of a liquid crystal display device, a display panel made of fluorescent character display tubes, a plasma display panel, a hybrid integrated circuit and the like, and material for forming a thick film pattern which is used in the method of forming a thick film pattern.
BACKGROUND ART
Conventionally, there is known a method of forming a thick film pattern by the steps of printing a paste for the conductor or insulator on a substrate made of glass or ceramic in the form of a pattern by screen printing, drying and calcinating the paste, and repeating the above steps. Recently in various fields, thick film patterns are formed on a substrate made of glass or the like using ceramic material. In this case, paste-like ceramic materials, which are formed by dispersing ceramics in a binder, are employed, and similarly, the thick film pattern is formed by the steps of printing the paste-like ceramic material by screen printing, drying and calcinating the paste-like ceramic material, and repeating the above steps.
In the conventional method of forming a thick film pattern on a glass substrate using a ceramic material by screen printing, in order to attain a film pattern having a desirable thickness, it is necessary to repeat screen printing several times. That is, in this method, it is necessary to repeat the screen printing five to ten times in order to attain a thick film having a thickness of 50 to 100 .mu.m, and a drying process is required every time. Therefore, the productivity is extremely low and the yield rate is lowered. Further, there is the problem that the accuracy of a line width of pattern is impaired due to viscosity of the paste, thixotropy or the like.
DISCLOSURE OF INVENTION
It is therefore a primary object of the present invention to provide a method of forming a thick film pattern which can improve the productivity and the yield rate, and can obtain an accurate line width of pattern.
A second object of the present invention is to provide a method of forming a thick film pattern in which ceramic material can reliably adhere to a substrate.
A third object of the present invention is to provide a method of forming a thick film pattern and material for forming a thick film pattern which can prevent paste material from being broken when drying and calcinating the same and strengthen the binding force between powdery solids and the adhesive force between powder solid and a substrate, and which can form a desirable thick film pattern by a calcinating process at a low temperature.
(1) According to a first aspect of the present invention, in a method of forming a thick film pattern by ceramic material on a substrate, the method comprising the steps of: forming a female mold having a desirable pattern on the substrate by other material except for ceramic material; filling the ceramic material in a space in the female mold; and causing the female mold to be removed (i.e., to vanish).
(2) According to a second aspect of the present invention, in the first aspect, the step of forming the female mold comprises the steps of providing a photoresist layer on the substrate and performing pattern exposure and development of the photoresist layer.
(3) According to a third aspect of the present invention, in the first aspect, the step of forming the female mold comprises the step of providing an ultraviolet curing resin having a desirable pattern on the substrate by 2P process.
(4) According to a fourth aspect of the present invention, in the first aspect, the step of forming the female mold comprises the step of foaming an organic foam provided on the substrate so as to have a desirable pattern.
(5) According to a fifth aspect of the present invention, in the first aspect, the step of forming the female mold comprises the steps of: coating an ultraviolet curing resin on the original plate having a concave-convex surface corresponding to a desirable pattern; providing a substrate film on the ultr
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patent: 4119480 (1978-10-01), Nishi et al.
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World Patents Index, week 2278, AN=78-39632A, Derwent Publications Ltd, London, GB; & JP-A-53 045 290 (Koatsu Gas Kogyo K.K.) 22-04-1978 * Abstract*.
Microelectronics and Reliability, vol. 25, No. 1, 1985, pp. 61-63, Oxford, GB; A. Singh et al.: "Reverse photolithographic technique for thick film circuits" * Whole document*.
Fujii Hideaki
Matsumoto Takeshi
Mineo Norikazu
Ono Norikatsu
Sakai Yorihiko
Dai Nippon Insatsu Kabushiki Kaisha
Derrington James
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