Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-08-02
2011-08-02
Parekh, Nitin (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000, C257S774000, C257S778000, C257SE23145, C438S108000, C438S109000
Reexamination Certificate
active
07989959
ABSTRACT:
A stacked-die integrated circuit and a method of fabricating same. The stacked-die integrated circuit has circuitry formed in the first surface of a mother die, a plurality of through-die vias with at least one through-die via providing electrical connection between the circuitry of the mother die and the second surface and a plurality of contact pads formed in the second surface of the semiconductor die for mounting a daughter die wherein some of the contact pads are electrically isolated dummy pads.
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Hardaway Michael
Maunu LeRoy D.
Parekh Nitin
Xilinx , Inc.
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