4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip

Michael Hardaway

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Method of forming stacked-die integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
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Self-biased electrostatic discharge protection method and...

Electricity: electrical systems and devices – Safety and protection of systems and devices – Load shunting by fault responsive means
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Testing of an integrated circuit having an embedded processor

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
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Profile ID: LFUS-PAI-P-2383784

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