Method of forming solid blind vias through the dielectric...

Details Method of forming solid blind vias through the dielectric... Method of forming solid blind vias through the dielectric...

2011-08-30

2011-08-30

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S618000, C438S678000, C257SE21006, C257SE21007, C257SE21027, C257SE21058, C257SE21077, C257SE21170, C257SE21320, C257SE21134, C257SE21231, C257SE21267, C257SE21278, C257SE21293, C257SE21329, C257SE21347

Reexamination Certificate

active

08008188

ABSTRACT:
A method is provided comprising: coating an electrically conductive core with a first removable material, creating openings in the first removable material to expose portions of the electrically conductive core, plating a conductive material onto the exposed portions of the electrically conductive core, coating the conductive material with a second removable material, removing the first removable material, electrophoretically coating the electrically conductive core with a dielectric coating, and removing the second removable material.

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