Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1979-12-31
1981-06-16
Smith, John D.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
156643, 228180A, 427 89, 427 96, 357 67, 430314, 430329, 430330, H01L 2188
Patent
active
042738598
ABSTRACT:
An improved method of forming raised input/output (I/O) terminals on the top surfaces of semiconductor elements of a semiconductor wafer. After via openings are formed through the passivation layer of such elements at locations where the I/O terminals are to be formed, which openings provide access to the metalization layers of the elements photolithographic techniques using a layer of heat resistant photoresist which is laminated to the top surface of the wafer are used to form openings through the photoresist layer to provide access to the metalization layers through the vias. A barrier metal layer is deposited on the exposed surfaces of the photoresist, and the metalization layers, and passivation layer of the elements. The barrier metal layer overlying the photoresist and then the photoresist are stripped from the wafer. The same photolithographic techniques using the same heat resistant photoresist material are used to define openings surrounding the barrier metal lining the via openings. A layer of solder is then deposited on the wafer. The solder overlying the photoresist and then the photoresist are stripped from the wafer. The solder is heated until it reflows to form raised I/O terminals of the devices which terminals each will have a substantially spherical exposed surface.
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A. van der Drift et al., "Integrated Circuits with Leads on Flexible Tape", Solid State Technology/Feb. 1976, pp. 27-35.
Kardashian Vahram S.
Mones Arthur H.
Sartell Jack A.
Holloway, Jr. Wm. W.
Honeywell Information Systems Inc.
Hughes Edward W.
Reiling Ronald T.
Smith John D.
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