Method of forming solder ball, and fabricating method and...

Details Method of forming solder ball, and fabricating method and... Method of forming solder ball, and fabricating method and...

2005-03-03

2008-09-23

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S617000, C438S612000, C257SE21508

Reexamination Certificate

active

07427558

ABSTRACT:
A method of forming solder balls may involve forming bumps through wire boding on land patterns of a circuit substrate. Solder cream may be applied to the bumps through screen printing. The solder cream may be melted via reflow to form solder balls in which the bumps are embedded.

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