Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-02-27
2007-02-27
Thai, Luan (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S618000, C257S778000, C257S779000, C257S780000
Reexamination Certificate
active
10852318
ABSTRACT:
In a socket used to house semiconductor die during testing, a recessed socket contact and methods of making the same are provided that avoid pinching the die's contacts. Semiconductor fabrication techniques are used to construct a dense array of contacts by forming a plurality of interconnected silicon electric contacts on a substrate having a first side and a second side, each silicon electric contact having a portion connected to the first side of the substrate and a portion extending from the first side of the substrate, applying an alignment-preserving material to the second side of the substrate having the plurality of interconnected silicon electric contacts formed on the side thereof, and disconnecting the plurality of interconnected silicon electric contacts from having electrical connection therebetween.
REFERENCES:
patent: 3735466 (1973-05-01), Jensen
patent: 4074342 (1978-02-01), Honn et al.
patent: 4420877 (1983-12-01), McKenzie, Jr.
patent: 4616406 (1986-10-01), Brown
patent: 4750092 (1988-06-01), Werther
patent: 4752250 (1988-06-01), Seidler
patent: 4772864 (1988-09-01), Otto et al.
patent: 4871317 (1989-10-01), Jones
patent: 4909746 (1990-03-01), Scholz
patent: 5043790 (1991-08-01), Butler
patent: 5067233 (1991-11-01), Solomon
patent: 5173055 (1992-12-01), Grabbe
patent: 5283459 (1994-02-01), Hirano et al.
patent: 5374204 (1994-12-01), Foley et al.
patent: 5386626 (1995-02-01), Cheng
patent: 5509814 (1996-04-01), Mosquera
patent: 5518410 (1996-05-01), Masami
patent: 5545050 (1996-08-01), Sato et al.
patent: 5631191 (1997-05-01), Durand et al.
patent: 5653601 (1997-08-01), Martucci et al.
patent: 5669774 (1997-09-01), Grabbe
patent: 5737818 (1998-04-01), Frank et al.
patent: 5741741 (1998-04-01), Tseng
patent: 5834062 (1998-11-01), Johnson et al.
patent: 5850693 (1998-12-01), Guran et al.
patent: 5896655 (1999-04-01), Knodler
patent: 5937277 (1999-08-01), Matsuda et al.
patent: 5945837 (1999-08-01), Fredrickson
patent: 5962921 (1999-10-01), Farnworth et al.
patent: 5984694 (1999-11-01), Sinclair
patent: 6007349 (1999-12-01), Distefano et al.
patent: 6049977 (2000-04-01), Atkins et al.
patent: 6069481 (2000-05-01), Matsumura
patent: 6081026 (2000-06-01), Wang et al.
patent: 6084421 (2000-07-01), Swart et al.
patent: 6092282 (2000-07-01), Roberts
patent: 6107109 (2000-08-01), Akjkram et al.
patent: 6174172 (2001-01-01), Kazama
patent: 6174174 (2001-01-01), Suzuki et al.
patent: 6190181 (2001-02-01), Affolter et al.
patent: 6193524 (2001-02-01), Chang
patent: 6208156 (2001-03-01), Hembree
patent: 6319333 (2001-11-01), Noble
patent: 6397460 (2002-06-01), Hembree
patent: 6417024 (2002-07-01), Kinsman
patent: 6579744 (2003-06-01), Jiang
patent: 6648654 (2003-11-01), Akram et al.
patent: 6725536 (2004-04-01), Akram et al.
patent: 6729027 (2004-05-01), Akram et al.
patent: 6735855 (2004-05-01), Akram et al.
patent: 6757972 (2004-07-01), Farnworth
patent: 06275775 (1994-09-01), None
patent: 08203644 (1996-08-01), None
patent: 09310057 (1997-12-01), None
patent: 90/11629 (1990-10-01), None
“Condel Test Socket Specifications”, Liberty Researc Socket Specifications, Web Page: www.liberty-research.com/sktspcs.htm, Feb. 10, 1998.
“Holeshot Test Socket and Adapter for Area Array Packages”, Liberty Research, Web Page: www.liberty-research.com/holeshot.htm, Feb. 10, 1998.
“Penta O Probe Sheet” Interconnect Devices, Inc., catalog page.
“Plunger Tip Styles by Size”, catalog page from Interconnect Devices, Inc.
“Probe Plunger Tip Application Guide” Interconnect Devices, Inc., Web Page: www.idinet.com/aguide.htm, Dec. 20, 1998.
“Series 654 Ball Grid Array Socket (on 1.27 mm pitch)”, catalog page, Wells Electronics, Inc., South Bend, Indiana.
“Series 654 Ball Grid Array Socket (on 1.5 mm pitch)”, catalog page, Wells Electronics, Inc., South Bend, Indiana.
“Series 655 OTBGA Burn-In/Test Socket (Pinch Contact)”, Wells-CTI, Web Page: www.wellscti.com/ser655p.htm, Dec. 16, 1998.
“Series 655 OTBGA Socket (Y Contact)” Wells-CTI, Web Page: www.wellscit.com/ser655.htm, Dec. 16, 1998.
“Test Sockets and Adapters for Area Array Packages”, Liberty Research, Web Page: www.liberty-research.com/arrayinfo.htm, Feb. 10, 1998.
Smith, “Circuits, Devices and Systems”, Fourth Edition, 1984.
LandOfFree
Method of forming socket contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of forming socket contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming socket contacts will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3816995