Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2004-04-14
2009-11-03
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S622000, C438S637000, C257SE21575
Reexamination Certificate
active
07611982
ABSTRACT:
The present invention relates to a laminated type electronic part and aims at providing a sheet manufacturing method and a sheet that contribute to high integration, downsizing and enhancement of reliability of the electronic part. To accomplish this object, the manufacturing method according to the present invention involves forming a layer composed of a positive resist on a support body, repeatedly executing an exposure process, a developing process and a depositing process of depositing a substance having a desired electrical characteristic into an obtained pattern space with respect to the layer, and thereafter removing the support body. The sheet composed of portions, having three or more types of different physical properties, of which an aspect ratio in pattern is equal to or larger than 1, is provided by this manufacturing method.
REFERENCES:
patent: 4604160 (1986-08-01), Murakami et al.
patent: 5309629 (1994-05-01), Traskos et al.
patent: 6555913 (2003-04-01), Sasaki et al.
patent: 6831357 (2004-12-01), Nishitani et al.
patent: 2005/0194084 (2005-09-01), Yoshida et al.
patent: 50-2059 (1975-01-01), None
patent: 51-118390 (1976-10-01), None
patent: 58-93298 (1983-06-01), None
patent: 59-32115 (1984-02-01), None
patent: 61-90496 (1986-05-01), None
patent: 61-127196 (1986-06-01), None
patent: 63-43396 (1988-02-01), None
patent: 63-244797 (1988-10-01), None
patent: 3-1830 (1991-01-01), None
patent: 3-7157 (1991-01-01), None
patent: 4-38158 (1992-06-01), None
patent: 5-39119 (1993-06-01), None
patent: 06-059117 (1994-03-01), None
patent: 6-36472 (1994-05-01), None
patent: 06-204665 (1994-07-01), None
patent: 07-211571 (1995-08-01), None
patent: 9-199663 (1997-07-01), None
patent: 10-012455 (1998-01-01), None
patent: 11-186097 (1999-07-01), None
patent: 2000-40633 (2000-02-01), None
patent: 2000-164457 (2000-06-01), None
patent: 2000-182870 (2000-06-01), None
patent: 2000-183530 (2000-06-01), None
patent: 2000-331858 (2000-11-01), None
patent: 2000-331865 (2000-11-01), None
patent: 2001-076959 (2001-03-01), None
patent: 2001-085264 (2001-03-01), None
patent: 2001-110662 (2001-04-01), None
patent: 2001-111223 (2001-04-01), None
patent: 2001 -267167 (2001-09-01), None
Aoki Shunji
Sutoh Junichi
Watanabe Genichi
Yoshida Masayuki
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
TDK Corporation
Trinh Michael
LandOfFree
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