Method of forming semiconductor device having an improved buried

Details Method of forming semiconductor device having an improved buried Method of forming semiconductor device having an improved buried

1996-11-06

1998-06-02

Niebling, John

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438637, 438643, 438648, 438650, 438672, 438687, H01L 2128

Patent

active

057599157

ABSTRACT:
The present invention provides a semiconductor device including an improved buried electrode formed by selective CVD. In this semiconductor device, a first insulation layer is formed on a semiconductor substrate. A first conductive layer is formed along an inner surface of a recess of an opening formed on the first insulation layer. A second conductive layer is formed on the first conductive layer in the recess of the opening. The second conductive layer is flush with the first insulation layer. The surfaces of the first and second conductive layers are coated with a third conductive layer. A second insulation layer is formed on the first insulation layer and the third conductive layer. A via hole is formed through the second insulation layer and the third conductive layer and reaches to the second conductive layer. A buried electrode layer is grown in the via hole and formed in contact with the second conductive layer. A fourth insulation layer has a group of conductive layers formed on the second insulation layer and the buried electrode layer and electrically connected to the second conductive layer through the buried electrode layer formed in the via hole.

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