Method of forming polarization reversal area, apparatus...

Etching a substrate: processes – Nongaseous phase etching of substrate – Irradiating – ion implanting – alloying – diffusing – or...

Reexamination Certificate

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C438S745000

Reexamination Certificate

active

07976717

ABSTRACT:
Provided are a method and an apparatus for forming a nanometer-order polarization-reversed region in a ferroelectric single crystal, and a device using the ferroelectric single crystal.The method according to the present invention for forming a polarization-reversed region in a ferroelectric single crystal includes the steps of grounding a first surface of the ferroelectric single crystal, and irradiating a second surface of the ferroelectric single crystal opposite to the first surface with an ion beam. The ion beam is irradiated such that the charge density Q (μC/cm2) accumulated on the second surface irradiated with the ion beam satisfies the following relationship:in-line-formulae description="In-line Formulae" end="lead"?0.7×Ps≦Q≦5×Psin-line-formulae description="In-line Formulae" end="tail"?where Ps is the spontaneous polarization (μC/cm2) of the ferroelectric single crystal.

REFERENCES:
patent: 5382334 (1995-01-01), Miyaguchi et al.
patent: 7115513 (2006-10-01), Chiang et al.
patent: 2005/0002605 (2005-01-01), Sakai et al.
patent: 2005/0181525 (2005-08-01), Tokuda et al.
patent: H07-013008 (1995-01-01), None
patent: H08-015741 (1996-01-01), None
patent: 2003-215379 (2003-07-01), None

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