Method of forming patterned silicone rubber layer

Details Method of forming patterned silicone rubber layer Method of forming patterned silicone rubber layer

1989-12-19

1991-01-29

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156653, 156657, 437228, 437231, 437241, H01L 21308, H01L 2131

Patent

active

049884034

ABSTRACT:
The present invention provides a method of forming a patterned silicone rubber layer on a surface of a workpiece such as a silicone wafer. According to the method, a polyimide film is first formed on the workpiece surface, and subsequently etched by lithography in a predetermined pattern. Then, a silicone rubber layer is formed on the workpiece surface over the patterned polyimide film by spin coating, and thereafter etched by plasma etching until the patterned polyimide film is exposed. Finally, the remaining polyimide film alone is completely etched away, so that the pattern previously given to the polyimide film is copied to the silicone rubber layer in a negative fashion.

REFERENCES:
patent: 3833436 (1974-09-01), Hillis et al.
patent: 4119483 (1978-10-01), Hubsch et al.
patent: 4218283 (1980-08-01), Saiki et al.
patent: 4399016 (1983-08-01), Tsukada et al.
patent: 4586976 (1988-05-01), Takano et al.
patent: 4677036 (1987-06-01), Nakamura et al.
Greschner et al., IBM Technical Disclosure Bulletin, vol. 25, No. 6, Nov. 1982, p. 2730.

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