Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2000-08-30
2003-12-16
Huff, Mark F. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S198000, C430S199000, C430S311000, C430S312000, C430S322000, C430S330000
Reexamination Certificate
active
06664029
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to a novel pattern-forming method, more particularly relates to a pattern-forming method which comprises laminating an actinic ray-curable coating film layer onto the surface of an insulating coating film-forming resin layer to obtain an laminate, directly irradiating a laser beam onto the laminate so that a predetermined relief may be obtained on the surface of the actinic ray-curable coating film layer, followed by subjecting the actinic ray-curable coating film layer to a developing treatment to form a resist pattern and subjecting an exposed insulating film-forming resin layer to a developing treatment, or directly irradiating a laser beam followed by simultaneously subjecting the actinic ray-curable coating film layer and the insulating film-forming resin layer to a developing treatment to obtain a predetermined pattern respectively.
BACKGROUND ART
The lithography in the art has been applied to a printed-circuit board, display panel, etching etc. as a method of forming a pattern on plastics, inorganic materials, etc.
The above method of forming the pattern comprises, for example, coating an actinic ray-curable, insulating pigment paste onto the surface of a substrate to form an actinic ray-curable, insulating layer, followed by irradiating through a photomask an electron beam or ultraviolet light onto the surface thereof, and subjecting the actinic ray-curable, insulating layer to a developing treatment to obtain a predetermined pattern.
However, the above method has such drawbacks that an unsatisfactory actinic ray-curability of the insulating layer makes it impossible to obtain a sharp pattern.
DISCLOSURE OF THE INVENTION
For the purpose of solving the above problems, the present inventors made intensive studies to find out that a pattern-forming method which comprises laminating an actinic ray-curable coating film layer onto the surface of an insulating film-forming resin layer so as to form a pattern, followed by irradiating directly or through a photomask an actinic ray or heat wave onto the surface thereof to form a predetermined resist pattern, successively subjecting the actinic ray-curable coating film layer and the insulating film-forming resin layer to a developing treatment and optionally removing the actinic ray-curable coating film layer, or followed by irradiating directly or through a photomask an actinic ray or heat wave onto the surface thereof and simultaneously subjecting the actinic ray-curable coating film layer and the insulating film-forming resin layer to a developing treatment respectively makes it possible to solve the above problems, resulting in completing the present invention.
That is, the present invention relates to a pattern-forming method which comprises the following steps:
(1) laminating an actinic ray-curable coating film layer onto the surface of an insulating film-forming resin layer,
(2) irradiating directly or through a photomask an actinic ray or heat wave thereonto so as to obtain a predetermined pattern,
(3) subjecting the actinic ray-curable coating film layer to a developing treatment to form a resist pattern coating film consisting of the actinic ray-curable coating film layer,
(4) and subjecting the insulating film-forming resin layer to a developing treatment, followed by removing; and a pattern-forming method which comprises the following steps:
(1) laminating an actinic ray-curable coating film layer onto the surface of an insulating film-forming resin layer,
(2) irradiating directly or through a photomask an actinic ray or heat wave thereonto so as to obtain a predetermined pattern, and
(3′) simultaneously subjecting the actinic ray-curable coating film layer and the insulating film-forming resin layer to a developing treatment so as to obtain a predetermined pattern, followed by removing.
PREFERABLE EMBODIMENT OF THE INVENTION
The actinic ray-curable coating film layer used in the present invention may include any known ones without particular limitations so long as difference in solubility in a developing solution depending on curing or decomposition in an actinic ray or heat wave-irradiated area makes it possible to form a resist pattern coating film.
Examples of a composition used in the actinic ray-curable coating film layer may include a liquid resist, photocurable resin composition such as an organic solvent based positive type photocurable resin composition, organic solvent based negative type photocurable resin composition, water based positive type photocurable resin composition, water based negative type photocurable resin composition and the like; a photocurable dry film such as a positive type photocurable dry film, negative type photocurable dry film and the like; a liquid heat-curable resin composition such as an organic solvent based negative type heat-curable resin composition, water based negative type heat-curable resin composition and the like; a heat-curable dry film such as a negative type heat-curable dry film, and the like.
Of these, particularly, the photocurable resin composition may preferably include visible light, negative type or positive type ones.
The negative type photocurable resin composition may include known ones containing, for example, a photocurable resin, photoreaction initiator and optionally a photosensitized dyestuff.
The photocurable resin may include any known photocurable resins having a photocurable group crosslinkable on photoirradiation and having such an ionic group, i.e. anionic group or cationic group, in the resin that an unexposed coating film may be dissolved in an alkaline developing solution or an acid developing solution to be removed without particular limitations. Examples of an unsaturated group as the photocurable group contained in the photocurable resin may include acryloyl group, methacryloyl group, vinyl group, styryl group, allyl group and the like.
A typical example of the anionic group as the ionic group may include carboxyl group. A carboxyl group content may be such that an acid value of the resin is preferably in the range of about 10 to 700 mg KOH/g, particularly about 20 to 600 mg KOH/g. When the acid value is less than about 10 mg KOH/g, a poor solubility of an uncured coating film during the developing treatment by use of the developing solution results drawbacks of unsatisfactory removal of copper during the following etching step. On the other hand, when the acid value is more than about 700 mg/KOH/g, a resist film or a cured coating film may easily come away, resulting in drawbacks of making it impossible to form a satisfactory copper circuit. A typical example of the cationic group may include amino group. An amino group content may preferably be such that an amine value of the resin is in the range of about 20 to 650, particularly about 30 to 600. An amine value less than about 20 results drawbacks of unsatisfactory removal of copper during the etching step as above mentioned. On the other hand, an amine value more than about 650 may undesirably result such drawbacks that the resist film may easily come away.
The anionic resin may include, for example, ones prepared by reacting polycarboxylic acid resin with a monomer such as glycidyl (meth)acrylate and the like so as to introduce unsaturated group and carboxyl group into the resin.
The cationic resin may include, for example, a resin prepared by an addition reaction between a hydroxyl group and tertiary amino group-containing resin and a reaction product of a hydroxyl group-containing unsaturated compound with a diisocyanate compound.
Details of the anionic resin and the cationic resin may be referred to the photocurable resin disclosed in Japanese Patent Application Laid-Open No. 223759/91.
The photoreaction or radical photopolymerization initiator may include ones known in the art, for example, aromatic carbonyl compounds such as benzophenone, benzoin methyl ether, benzoin isopropyl ether, benzylxanthone, thioxanthone, anthraquinone and the like; acetophenones such as acetophenone, propiophenone, &agr;-hydroxyisobutylphenone, &
Honma Hiroyuki
Imai Genji
Kogure Hideo
Ohnishi Kengo
Fisher Christen & Sabol
Huff Mark F.
Kansai Paint Co. Ltd.
Sagar Kripa
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