Method of forming micropatterns utilizing silylation and overall

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430328, G03F 736, G03F 738

Patent

active

056795009

ABSTRACT:
A resist film is formed on a semiconductor substrate by using a chemical amplification resist which generates an acid in response to the radiation of KrF excimer laser light and which reacts with the acid. If the resist film is irradiated with the KrF excimer laser light through a mask, the acid is generated in the surface of an exposed portion of the resist film, so that the surface of the exposed portion is made hydrophilic by the acid. If water vapor is supplied to the surface of the resist film, water is diffused from the surface of the exposed portion into a deep portion. If vapor of methyltriethoxysilane is sprayed onto the surface of the resist film in air at a relative humidity of 95%, an oxide film with a sufficiently large thickness is selectively formed on the surface of the exposed portion.

REFERENCES:
patent: 5094936 (1992-03-01), Misium et al.
patent: 5215867 (1993-06-01), Stillwagon et al.
patent: 5278029 (1994-01-01), Shirai et al.
Schellekens et al., "Single Level Dry Developable Resist Systems . . . ", SPIE 1989, pp. 1-9.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of forming micropatterns utilizing silylation and overall does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming micropatterns utilizing silylation and overall, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming micropatterns utilizing silylation and overall will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1005608

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.