Method of forming metal wiring in a semiconductor device

Details Method of forming metal wiring in a semiconductor device Method of forming metal wiring in a semiconductor device

2007-02-27

2007-02-27

Everhart, Caridad (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S702000, C257SE21579

Reexamination Certificate

active

10989668

ABSTRACT:
A method of forming metal wiring in a semiconductor device is disclosed. The method uses a dual damascene process in which a trench is formed prior to a via-hole.

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