Method of forming low-K interlevel dielectric layers and...

Details Method of forming low-K interlevel dielectric layers and... Method of forming low-K interlevel dielectric layers and...

2005-07-27

2008-12-02

Cleveland, Michael (Department: 1792)

Coating processes

Heat decomposition of applied coating or base material

Reexamination Certificate

active

07459183

ABSTRACT:
A method of forming a structure. The method including: forming a precursor layer on a substarte, the precursor layer including a resin and, polymeric nano-particles dispersed in the resin, and a solvent, each the polymeric nano-particle comprising a multi-arm core polymer and pendent polymers attached to the milti-arm core polymer and pendent polymers attached to the multi-arm core polymer, the multi-arm core polymer immiscible with the resin and the pendent polymers miscuble with the resin; heating the precursor layer to cross-link at least about 90% of the resin thereby converting the pre-baked precursor layer to a dielectric layer; forming trenches in the dielectric layer and filling the trenches with an electrical conductor; heating the dielectric layer to thermally decompose at least acout 99.5% of the polymeric nano-particles into decomposition products and to drive the decomposition products out of the dielectric layer.

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