Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2007-10-09
2007-10-09
Picardat, Kevin M. (Department: 2822)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S029000, C438S065000, C257SE33067
Reexamination Certificate
active
10938237
ABSTRACT:
A method of bonding a transparent optical element to a light emitting device having a stack of layers including semiconductor layers comprising an active region is provided. The method includes elevating a temperature of the optical element and the stack and applying a pressure to press the optical element and the stack together. In one embodiment, the method also includes disposing a layer of a transparent bonding material between the stack and the optical element. The bonding method can be applied to a premade optical element or to a block of optical element material which is later formed or shaped into an optical element such as a lens or an optical concentrator.
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Camras Michael D.
Hofler Gloria E.
Krames Michael R.
Lowery Christopher H.
Mueller Gerd O.
Patent Law Group LLP
Philips Lumileds Lighting Company LLC
Picardat Kevin M.
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