Method of forming layered structure for adhering gold to a subst

Details Method of forming layered structure for adhering gold to a subst Method of forming layered structure for adhering gold to a subst

1989-12-12

1991-08-06

Beck, Shrive

Chemistry: electrical and wave energy

Processes and products

Coating, forming or etching by sputtering

427250, 427 34, 427404, 4274197, 437246, 20419238, C23C 400

Patent

active

050375172

ABSTRACT:
A method of forming a layered structure for adhering gold to a substrate is disclosed. The layered structure includes a first layer overlying the substrate. The first layer includes a member selected from the group consisting of metal nitrides, metal carbides and metal carbonitrides wherein the metal is selected from the group consisting of titanium, zirconium and hafnium. The layered structure also includes a transparent layer of refractory metal which overlies the first layer and underlies the gold or alloy thereof. The disclosed method includes forming the aforementioned first layer over the substrate and then forming the transparent layer of refractory metal on the first layer. Both the first layer and transparent layer are preferably formed or deposited on the substrate by a cathodic arc plasma deposition process. The method also includes forming a top layer of gold or an alloy thereof on the transparent layer, which gold layer is preferably formed or deposited by a magnetron sputtering process.

REFERENCES:
patent: 4415421 (1983-11-01), Sasanuma
patent: 4430184 (1984-02-01), Mularie
patent: 4591418 (1984-10-01), Snyder
patent: 4702967 (1987-10-01), Black et al.
patent: 4753851 (1988-06-01), Roberts et al.

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